Arm seeks to define baseline software compatibility for IoT and edge devices
SystemReady program takes server firmware and operating system compatibility concepts into the embedded and IoT space.
Author Archives: Chris Edwards
Aprisa team to be doubled after Mentor purchase
Mentor, a Siemens business, plans to expand the team working on the Aprisa place-and-route tool following the purchase of Avatar Integrated Systems, announced in July.
nVidia commits to buy Arm from Softbank
Graphics and AI specialist nVidia has been confirmed as the buyer of Arm from Softbank Vision Fund in a transaction worth up to $40bn, with the fund retaining a 10 per cent share in Arm if the deal completes.
TSMC fills in sub-nodes as EUV gains ground
TSMC is using its growing experience with EUV lithography to fill in sub-nodes between its major releases as it prepares to extend finFET technology to the forthcoming N3 process.
Cadence uses machine learning to trim constrained-random runtimes
Cadence has developed a stimulus optimizer based on neural networks to try to improve the runtime of constrained-random verification runs.
Open-RAN puts more focus on emulation in testing programs
Recent developments have made Open-RAN look more attractive as a way of implementing 5G systems. This is helping to drive a shift-left in verification and test.
Open and proprietary verification tools home in on RISC-V core quality
DAC provided a forum for the growing number of verification efforts focused on checking the architectural compliance and overall RTL quality of RISC-V processors.
Accellera IP security group expects standard by year end
The chair of Accellera’s IP security assurance working group expects the draft standard for hardening hardware core to be out by the end of the year.
DAC Pavilion focuses on cloud-scaling issues
Talks in the Design-on-Cloud Pavilion at this year’s DAC demonstrated how the question over its usage is not so much whether design could or should migrate to the cloud but how to optimize cost and performance when it’s there.
3D integration technologies will blend says TSMC chief scientist
DTCO and 3D integration will dominate scaling in the coming decade, TSMC chief scientist Philip Wong claimed in his keynote at DAC on Monday