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April 28, 2022

Go inside proposals for common chiplet models

Chiplets will need models to guarantee heterogenous SiP implementation. A cross-industry working group describes its progress so far.
October 19, 2017

Microsemi sets up RISC-V partner program

Microsemi has set up an ecosystem program around the RISC-V soft cores the company has designed for its FPGAs.
Article  |  Topics: Blog - EDA, Embedded, IP  |  Tags: , ,   |  Organizations: ,
March 24, 2017

The return of the CEO Outlook

The ESD Alliance is relaunching the annual panel session featuring CEOs from ARM, Cadence Design Systems, Mentor Graphics and Synopsys in Mountain View on April 9.
June 16, 2015

Collaboration let HiSilicon accelerate 16nm finFET plans

HiSilicon claims close collaboration with foundry and EDA tools partners helped speed up plans to tape out the first 16nm finFET-based design through TSMC.
July 4, 2014

Qualcomm takes 28nm to China in SMIC deal

Chinese foundry Semiconductor Manufacturing International Corporation (SMIC) is to get a helping hand to develop a production-class 28nm process from Qualcomm Technologies.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations: , ,
April 15, 2014

Common Platform foundry alliance to be wound down

But some research and process collaboration is set to continue in the background as Samsung, GlobalFoundries and IBM chart their own priorities.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: , , ,
April 4, 2014
Transistors on IDTechEx Printed Electronics 2014 demonstrator

Conference demonstrator brings printed-electronics suppliers together

For its Printed Electronics conference, IDTechEx pulled together a team together with P&G to develop a collaborative demonstration of the technology.
May 1, 2013

NXP captures tools for ARM micros with Code Red buy

NXP Semiconductors has decided to buy tools supplier Code Red Technologies to help build up software support for its ARM-based microcontrollers.
Article  |  Topics: Blog - Embedded  |  Tags: , , , ,   |  Organizations: ,
October 4, 2012

IEF: “Industry will have to cooperate”

The semiconductor industry is reaching a crunch point at which companies that form it have to work together much more closely, says Malcolm Penn of Future Horizons.
Article  |  Topics: Commentary, Conferences, Design to Silicon, Blog - EDA  |  Tags: , ,   |  Organizations: ,
February 29, 2012

Technical Newsletter #1: Common Platform, Samsung, ARM, Cadence

Our first email newsletter previews next month's Common Platform Technology Forum 2012 and features exclusive interviews with senior staff at Samsung, ARM and Cadence Design Systems.

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