Verification

February 8, 2022

How digital twin evaluations optimize STCO-based design

System Technology Co-optimization raises various SI, PI, thermal, mechanical and warp risks due to its use of advanced packaging. Early-stage prototyping mitigates them.
January 25, 2022

Silicon Photonics verification case study from UC-Davis and Texas A&M

Silicon Photonics 3D integration posed LVS challenges in this fast emerging technical space. A case study describes how the two institutions overcame them.
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January 25, 2022

Choose the right advanced packaging methodology for metal fill rules

Advanced packaging requirements from foundries and OSATs pose stringent challenges. A new paper describes three ways of satisfying them.
December 6, 2021

DAC 2021 preview: Breker Verification Systems

Breker will highlight its latest work on stress-testing processor, storage and I/O architectures during DAC 2021 this week.
December 3, 2021

DAC 2021 preview: Verific

Tool development enabler Verific will demonstrate its parsers, including a combination with the INVIO API platform at DAC 2021 in San Francisco next week.
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December 3, 2021

Axiomise expands formal training services from beginner to expert

The formal specialist is offering courses across six tiers, including case studies and lab work, with immediate availability.
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December 3, 2021

DAC 2021 preview: SmartDV

The design and verification IP specialist will present its full range, including the Smart Compiler, at next week's Design Automation Conference.
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November 23, 2021

DAC 2021 Preview: Siemens EDA

DAC 2021 is looming and here is our first round up of a major EDA player's plans for the physical event in San Francisco.
September 28, 2021

Scaling power integrity analysis to match analog content in today’s designs

Siemens introduces mPower to bridge the analog-to-digital gap in IR-drop and EM analysis, reflecting the scaling trends in today's ICs.
August 18, 2021

Overcome reset domain crossing challenges when using UPF

A DVCon technical paper addresses potential reset domain crossing metastability issues due to UPF instrumentation.

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