Multi-patterning, finFETs and more are forcing more detailed overhauls of P&R software at each process node. We dig into some of the key new issues and how they are being addressed.
AMD's Radeon R9 family is the result of eight years developing 3D-IC and interposer technology. What lessons did the company learn?
John Sturtevant looks at ongoing preparations for the incoming node and charts significant progress that has already been made.
Precise curved geometries are vital to making this emerging and cost-effective CMOS-based technology work. This primer explains its advantages and how litho tools are evolving to meet the challenges it presents.
Fab and IP vendor collaboration is making pattern matching-based libraries a vital component of DRC accuracy and efficiency. Learn how to take advantage.
FInFET memories have different defects than those based on planar transistors. Here's how to test and repair them.
Innovation in physical verification is driven by incoming nodes but new tools and features can and should be fed back up the technology chain.
Sign-off lithography verification is vital as we move beyond double to multi-patterning but changing responsibilities in the flow must be handed with care.
A change in the way the core compact models are developed has accelerated their development and, for the first time, allowed the models to be used not just for circuit simulation but to help guide process evolution as chipmakers play not only with materials but the shape of finFETs.
Complexity and the increasing use of thermal analysis software by non-expert designers demands new approaches for chip and PCB implementations.
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