AI

November 30, 2023

Benchmarking the maturity of AI in EDA

Solido discusses how it has leveraged AI for SPICE level efficiency and the benchmarks it has used.
November 20, 2023

ETRI builds flow for AI chiplets

South Korea's leading research institute has built a reusable flow for lower power petaflops-performance AI.
Article  |  Topics: Blog - EDA, - HPC, Next Generation Design, Packaging, Verification  |  Tags: , , ,   |  Organizations: , ,
October 3, 2023

Siemens and CEA link up on AI-assisted digital twins

Siemens and CEA-List have signed a deal under which the two organisations will research the combination of digital-twin and AI.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , ,   |  Organizations:
September 6, 2023

HPC and AI provide keynote focus at DVCon Europe

DVCon Europe has announced its two keynote presentations, focusing on energy-efficient high-performance computing and machine learning.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , ,   |  Organizations: ,
July 14, 2023

Cadence mixes know-how and AI to bridge RTL gap

The Joules RTL Design Studio aims to make coding more aware of aware of physical issues before and after hand-off for implementation.
Article  |  Topics: Blog Topics, Physical design, RTL, Verification  |  Tags: , , , , ,   |  Organizations: , , ,
July 10, 2023

Siemens fuels custom IC flows with artificial intelligence

Three fast developing AI techniques underpin the efficiencies in the new Solido custom design and verification platform.
May 30, 2023

Charting the path for machine learning in functional verification

A comprehensive review of ML's potential and its current use identifies challenges ahead.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , ,   |  Organizations:
December 1, 2022

Identifying AI opportunities in PCB design

The key to exploiting AI is being clear about where its family of technologies can help to improve and democratize design.
November 23, 2022

Chipletz pushes packaging design for AI, HPC and immersive use-cases

The Austin-based start-up used Siemens EDA software to deploy a cutting-edge Smart Substrate based on advanced packaging technology.
July 12, 2022

Devgan plans for optimization through machine learning

Cadence president expects expanded role for reinforcement learning in tool portfolio and looks for help on AI for verification.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , ,   |  Organizations:

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