Author Archives: Paul Dempsey

About Paul Dempsey

Paul Dempsey is editor-in-chief of Tech Design Forum and has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.
April 2, 2012

Making FPGA prototyping easier

The latest release of the Synplify Pro and Premier synthesis tools from Synopsys addresses stop-start delays and HDL experience issues when prototyping with programmable logic.
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March 27, 2012

Yocto Project gets a useful shove from Mentor

The Yocto Project brings the 'ecosystem' concept to embedded Linux and the tool vendor's launch builds that idea out nicely.
Article  |  Topics: Blog Topics, Commentary, Blog - Embedded  |  Tags: , ,
March 22, 2012

TSMC Altera heterogeneous integration is cool but is it 3D?

This looks more like 2.5D silicon interposer-based technology to us, though it is a major and necessary advance
Article  |  Topics: Commentary, Design to Silicon, Blog - EDA, PCB  |  Tags: , ,
March 21, 2012

CPTF notebook: The end of planar

It's time for everyone to start thinking about how to handle the incoming finFET age.
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March 20, 2012

Japan one year on: a need to rebuild exposed?

Beyond the earthquake, analyst IHS says the tragedy revealed systemic problems with an aging semiconductor fab base
March 20, 2012

By the numbers: Penn’s take on WSTS

Future Horizons' Malcolm Penn warns of capacity crunch later this year
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March 15, 2012

CPTF notebook: From restricted to ‘proscriptive’ design rules

Ever increasing lithography challenges mean the next generation of design rules may concentrate on telling you just what you can rather than what you cannot do.
March 15, 2012

CDN Live: Cadence’s Encounter revamp collates innovation

Performance boost claimed from streamlining optimization across synthesis and layout using modeling, novel CTS strategy and 20nm-ready features.
March 14, 2012

By the numbers: investment, equipment, sales

We round up the latest headline forecasts and performance data from the Global Semiconductor Alliance (GSA), manufacturers association SEMI and the Semiconductor Industry Association.
March 13, 2012

TDF Circuits #1: BASIC sets clearer path to healthcare monitoring

Wearable healthcare monitoring systems are a fast growing market, and could surge when clearer device approval regimes are introduced globally. Despite that brake on growth, companies and research organizations continue to innovate in anticipation. The subject of the first TDF Circuits, a graphics-led series looking at innovative implementations, is a subset of the Bio-potential Acquisition […]