Siemens EDA

July 30, 2020

Second formal check aids deadlock hunting

Arm works with EDA to find new efficiencies based on extra CTL-based check in Questa runs.
Article  |  Topics: Verification  |  Tags: , , , ,   |  Organizations: , ,
July 29, 2020

Litho hotspot analysis gets machine-learning turbocharge

A Mentor-Samsung collaboration cuts the need for model-based analysis and speeds analysis runtime by as much as 20X.
July 21, 2020

DAC Pavilion focuses on cloud-scaling issues

Talks in the Design-on-Cloud Pavilion at this year’s DAC demonstrated how the question over its usage is not so much whether design could or should migrate to the cloud but how to optimize cost and performance when it’s there.
July 20, 2020

FastSPICE upgrade boosts nano-scale analog verification by up to 10X

Mentor adds Analog FastSPICE eXTreme innovations for designs facing increasing parasitic complexity and contact resistance challenges at cutting edge nodes.
July 20, 2020

Mentor tunes LVS for early SoC integration

Mentor has released a tool that attempts to deal with the problems encountered in the use of physical circuit verification in the early stages of SoC integration.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations:
July 16, 2020

Mentor brews up a warm welcome at virtual DAC

Mentor, a Siemens Business, will offer a broad range of technical and market insights at the event – as well as a free virtual coffee for those who visit its virtual booth at the show.
Article  |  Topics: Conferences  |  Tags: , ,   |  Organizations: ,
June 23, 2020

Mentor to use UltraSoC acquisition to drive in-life learning

Siemens has agreed to acquire UK-based debug and on-chip instrumentation startup UltraSoC and will fold the operation into Mentor’s Tessent test-software product line.
Article  |  Topics: Blog - IP  |  Tags: , , , , ,   |  Organizations: ,
June 23, 2020

How to draw upon Mentor-Microsoft integration for embedded IoT

The combination of Embedded Linux and Azure is supported by services and technologies that speed the delivery and deployment of MCU-based projects.
June 18, 2020

How Ambarella met the demands of automotive DFT

Even experienced IC design houses must adopt innovative and emerging strategies to meet functional safety and other demands of ISO 26262 for automotive systems.
June 17, 2020

Siemens raises Capital to full E/E design level

Capital has been grown from a wire harness suite to a full electrical/electronic platform with integration for digital twin strategies.

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