February 8, 2013

Cadence buys IP provider Cosmic

Cadence Design Systems is to buy Cosmic Circuits Private Limited, a developer of analog and mixed signal intellectual property (IP) cores.
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February 6, 2013

GlobalFoundries inks IP deals

GlobalFoundries has signed deals to let the foundry offer power-saving clocks, a massively parallel floating-point processor and interface IP from Rambus. They are "uncommon solutions" to come from a foundry, the company claims.
January 30, 2013

Mentor updates HyperLynx for faster boards, more rules checking

Mentor's HyperLynx gets speed and accuracy enhancements, as well as more embedded help, to speed up fast board design
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January 28, 2013

Cadence updates Virtuoso for the 20nm generation

Cadence Design Systems has built into its latest Virtuoso update features designed to tackle the problems of working with the 20nm generation of processes with finer control over layout-dependent effects, double patterning and new types of local interconnect.
December 21, 2012

Samsung lines up tool providers for finFET tapeouts

14nm finFET test-chip designs are moving through Samsung's fab as ARM, Cadence Design Systems and Synopsys continue to check their flows on the new process.
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December 12, 2012

Process development needs hierarchy, abstraction, says tools CTO

How to save money in process development by moving experiments out of the fab and into the computer.
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December 5, 2012

IPSoC: Software power optimization ‘must start earlier’

Embedded software engineers need to focus on power optimization in their code much earlier and more comprehensively than many of them do today, says Mentor Graphics technologist Colin Walls.
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December 4, 2012

IPSoC: Configurability and the rise of the IP factory

Traditional IP reuse is giving way to configurable, customized cores delivered by semi-automated "IP factory" groups.
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December 4, 2012

IPSoC: 20nm causes analog ‘density fill headaches’

20nm design is fraught with problems for analog design but one that causes the biggest headaches is density variation, says Synopsys' Joachim Kunkel.
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December 4, 2012

FinFET tipsheet for IEDM

finFETs are vital to the next generation of CMOS processes from Intel, TSMC and others. How will process issues including bulk vs SOI substrates, density limitations, thickness control, and planar device integration affect their practical implementation?


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