Chipmaker

May 21, 2019

Achronix deploys network on chip for faster FPGAs

Achronix is introducing an FPGA architecture that pulls a full network-on-chip into the programmable-logic fabric combined with hardened matrix-math processors for AI.
Article  |  Topics: Blog - IP, PCB  |  Tags: , , , , , , , ,   |  Organizations:
May 20, 2019

DAC 2019 preview: Mentor

Mentor is active across the program and its main and Verification Academy booths within the exhibition in Las Vegas.
May 13, 2019

Security, machine learning, and variety at DAC

Security and machine learning are two topics that take center stage at DAC this year, says the conference’s general chair Rob Aitken.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , , ,   |  Organizations: , ,
April 22, 2019

Machine learning and chiplets headline VLSI Symposia

Large-scale MCMs and novel device architectures bookend the papers on machine learning at VLSI Symposia in an event that will also cover chiplet integration and other topics.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , ,   |  Organizations: , ,
April 18, 2019

User2User Silicon Valley is two weeks away

Mentor's technical conference will take place on May 2 at the Santa Clara Marriott and feature more than 45 user and vendor presentations.
April 9, 2019

DAC announces first set of keynotes for 2019

Electronic musician Thomas Dolby will be among the keynote speakers at the 56th Design Automation Conference (DAC) in Las Vegas.
April 4, 2019

ODSA weighs options for chiplet interconnect

An Open Compute Project group working on multichip integration sees a combination of parallel and serial interfaces being important for interchip communication.
March 18, 2019

PCI may provide key to OCP chiplet standard

The ODSA Workgroup formed by Netronome and others is looking to adopt the PIPE standard for interconnecting chiplets as it starts work on a proof-of-concept module.
March 11, 2019

China Focus 3: The R&D template

5G has given Beijing a development template to use across its Made in China 2025 program.
Article  |  Topics: Commentary, Conferences, Blog - EDA, IP  |  Tags:   |  Organizations: , , , , ,
March 6, 2019

MACOM to use GlobalFoundries 300mm SOI for PICs

MACOM has decided to use GlobalFoundries' 90nm SOI process on 300mm wafers to build higher-integration optical-switching devices for servers.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , , ,   |  Organizations: