40nm

February 21, 2018

Bulk transistor design aims for near-threshold power cuts

Semiwise, a startup founded by University of Glasgow professor Asen Asenov and former CEO of Gold Standard Simulations (GSS), has developed a low-power CMOS transistor technology suitable for ultralow-power sensor nodes.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , ,   |  Organizations:
June 6, 2016

Menta launches fourth-generation embedded FPGA core

Menta SAS has launched an embedded FPGA core family that improves density over previous versions.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , ,   |  Organizations:
June 10, 2015

TSMC adds Cadence and Imagination subsystems for IoT

Foundry strikes two more Internet of Things subsystem deals for its 55nm ULP process based on Cadence Tensilica and Imagination MIPS/PowerVR cores.
June 8, 2015

DTCO tool aims to squeeze more out of older processes

Gold Standard Simulations (GSS) has launched a tool intended to help fabless chipmakers squeeze more out of existing processes rather than accept the risk and expense of moving to more advanced, finFET-based processes.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , ,   |  Organizations:
June 8, 2015

S3 aims at MIMO WiFi with smaller ADC core

S3 Group has launched the second in a family of low-power successive-approximation ADCs, with a design that supports sample rates up to 320MS/s.
Article  |  Topics: Blog - IP  |  Tags: , , , , , ,   |  Organizations:
October 1, 2014

The changes demanded by IoT design

Does the internet of things (IoT) require a change in design techniques? A number of people involved in the EDA industry reckon it does.
September 29, 2014

TSMC adds sub-micron low-leakage processes

TSMC has launched three processes the foundry is aiming at internet-of-things (IoT) and wearable-device designs, providing lower-leakage versions of its 55nm, 40nm and 28nm processes.
Article  |  Topics: Blog Topics  |  Tags: , , , , , ,   |  Organizations: , ,
August 13, 2014

Thermal limits challenge Hot Chips power pair

Two of the custom designs presented at the 26th Hot Chips in Cupertino exemplified the problems caused by increasing power density and the benefits of looking at heat removal at the system level.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , , , , ,
March 20, 2014

ADC design shifts gears for lower power

SAR analog-to-digital converters promise better energy efficiency for a growing range of designs, as S3 Group has found.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , ,   |  Organizations:
August 29, 2013

IP providers make plans for the internet of things

ARM and Synopsys both plan to make inroads to the internet of things with their IP strategies.
Article  |  Topics: Blog - EDA, Embedded, IP  |  Tags: , , , , , , ,   |  Organizations: ,

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