Manufacturing giant says we need a new category of WPUs - wearables processing units - to create a mass market and that ARM needs to go smaller than the MO.
Focus on systemic issues matches DVCon Europe event to European interests
Any conference can only be as good as the feedback it gets. And next year's DAC team is actively looking for yours. It'll be worth your time.
Panel discusses Moore's law scaling beyond the 14nm node to 5nm, where economic, device, interconnect, materials, lithography and design issues abound
Building the internet of Things will demand collaboration and a healthy ecosystem
Head of TSMC R&D talks about what it will take to develop and use 10nm, 7nm processes, and a possible shift to using packaging to extend Moore's law scaling
New markets such as hardware cyber security, automotive and embedded software key to EDA industry growth
Samsung, Synopsys and ARM have been working together to create a finFET design ecosystem.
Whether you're going to DAC this week or not, it's worth remembering one of the other key factors that will inform your judgments on new tools.
Managing finFET variability issues without extending design times is key to extracting the most from the new processes, key players told a panel at the recent SNUG meeting in Santa Clara.
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