Foxconn’s wishlist for wearables and the Internet of Things
Manufacturing giant says we need a new category of WPUs - wearables processing units - to create a mass market and that ARM needs to go smaller than the MO.
Conferences
DVCon Europe focuses on systems design and verification
Focus on systemic issues matches DVCon Europe event to European interests
Don’t just whine – it’s time for you to help shape DAC 2015
Any conference can only be as good as the feedback it gets. And next year's DAC team is actively looking for yours. It'll be worth your time.
Path to 5nm plotted at DAC panel
Panel discusses Moore's law scaling beyond the 14nm node to 5nm, where economic, device, interconnect, materials, lithography and design issues abound
Internet of Things: an opportunity, but for whom?
Building the internet of Things will demand collaboration and a healthy ecosystem
Cliff Hou, TSMC VP R&D, on the route to 10nm – and beyond
Head of TSMC R&D talks about what it will take to develop and use 10nm, 7nm processes, and a possible shift to using packaging to extend Moore's law scaling
EDA industry must look to new markets for growth – Rhines
New markets such as hardware cyber security, automotive and embedded software key to EDA industry growth
Samsung certifies Synopsys tools, IP at 14nm
Samsung, Synopsys and ARM have been working together to create a finFET design ecosystem.
Mentor’s Wally Rhines on tools as a cultural issue
Whether you're going to DAC this week or not, it's worth remembering one of the other key factors that will inform your judgments on new tools.
FinFET variability issues challenge advantages of new process
Managing finFET variability issues without extending design times is key to extracting the most from the new processes, key players told a panel at the recent SNUG meeting in Santa Clara.