Blog Topics

July 12, 2018

With RF, power and MRAM, FD-SOI finds its role

FD-SOI is gradually building up a presence as a technology not just for low-power but RF and power integration.
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July 11, 2018

Leti and Soitec partner for wafer development

Research institute Leti and Soitec have decided to team up to work on a new generation of engineered substrates, such as specialized SOI wafers.
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July 5, 2018

Cloud makes hardware acceleration more accessible

After the moves by Cadence and Mentor, emulation in the cloud may only be the start of providing verification acceleration as a service.
July 3, 2018

Fusion improves timing say Synopsys users

Early-access customers talked about their experiences with the Synopsys Fusion-based flow in a panel session at the DAC.
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July 2, 2018

Tools suppliers back version 1.0 of portable-stimulus standard

Accellera has published the first release of the Portable Test and Stimulus Standard (PSS), with tools suppliers following up with software support.
June 27, 2018

EDA needs to work on the back end, says Qualcomm

It’s the back-end that needs work as system-level considerations begin to dominate design, Qualcomm’s vice president of engineering said at DAC.
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June 27, 2018

Remember the design gap? It’s back

Fifteen years on from the design gap that triggered the IP revolution, implementation costs have created a new one.
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June 26, 2018

EDA learns to love AI

Machine learning is gradually moving into implementation and verification tools for EDA.
June 25, 2018

IoT devices need surprises, Amazon claims

IoT device makers should play more with their software and make use of techniques used in website design to increase overall usability, Amazon’s head of IoT analytics has claimed.
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June 25, 2018

Cadence puts tools in the cloud

Cadence Design Systems has made a collection of its tools suitable for cloud computing, providing them for both Cadence- and customer-managed environments.
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