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Virtual strategies make for greater productivity and widen the number of emulation use cases. A new paper considers some of the most popular examples.

Design-services company Sondrel is recommending teams start earlier on package design to avoid delays after IC tapeout.

The metal has done sterling service for 20 years but the time is approaching to find a replacement for copper as problems with parasitics continue to build up, work presented at last month’s IEDM shows. But it's not an obvious switch.

Work by the University of Toronto and Arm presented at IEDM indicates plasmonics could be a viable contender for high-speed chip-chip communications.

Work presented at IEDM 2020 shows taking advantage of the IC backside for power and ground for the additional area can deliver further benefits for IR drop and security.

Computational storage devices are posing a new raft of challenges that is being addressed using a powerful pre-silicon methodology.

Arm is pushing more work onto Arm servers in the AWS cloud as it encourages EDA vendors to port their tools to the architecture.

At IEDM this year, Macronix showed how a 3D architecture may bring back NOR flash, which stopped scaling a decade ago.

Imec's senior vice president of CMOS outlined future directions for the technology over the coming decade.

Mentor, a Siemens business, has rebranded as Siemens EDA, almost almost four years after the EDA company was acquired.