EDA

October 22, 2019

Semicon Europa adds design and smart-transportation seminars

The ESD Alliance is adding design and transportation-systems streams to the Semicon Europa 2019 show.
October 14, 2019

Integration forms highlights of upcoming IEDM

Different forms of heterogeneous integration take center stage at the IEEE International Electron Device Meeting (IEDM) in December this year.
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October 14, 2019

DVCon Europe looks to software for next phase in verification

October's DVCon Europe conference will have an increased focus on the role of software in electronic systems and the challenges it poses to verification.
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October 8, 2019

Automotive companies form self-driving vehicle computing group

Arm is among a group of automotive OEMs and component suppliers who have set up a consortium to try to coordinate the development of autonomous-vehicle electronics.
October 8, 2019

Arm to let customers bolt instructions onto V8 processors

Arm has relented on its opposition to custom instructions with the decision to let customers add them to V8-M processors.
October 7, 2019

Master the design and verification of next gen transport: Part Four – emulation

Emulation is already playing a vital role in advanced automotive design within a digital twin environment.
October 3, 2019

X-Fab expands MPW access through Europractice

Mixed-signal foundry X-Fab has expanded the range of processes that it will offer for prototyping through the Europractice service.
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October 1, 2019

Low-power pioneer to receive 2019 Kaufman Award

Mary Jane Irwin of Penn State University has been named as the first female recipient of the Phil Kaufman Award for contributions to electronic design.
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September 30, 2019

Arm TechCon 2019 preview: Mentor

Mentor is active across the program at Arm TechCon with a range of conference and booth talks, demonstrations and presentations.
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September 18, 2019

Cadence expands system analysis to thermal

Cadence has followed its launched of a parallelizable EM simulator with one that focuses on the thermal behavior of ICs through to multi-PCB assemblies.
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