Chipmaker

November 1, 2012

Standards group forms to push ‘white space’ radio

A group of companies based in the UK have formed a group that hopes to develop and promote standards for machine-to-machine (M2M) communications that employ gaps in radio spectrum rather than relying on dedicated frequency bands.
Article  |  Topics: Blog - Embedded  |  Tags:   |  Organizations: ,
October 30, 2012

ARM’s 64bit shift provides clean-up opportunity

ARM has named the first pair of processor cores that employ its 64bit architecture and revealed that an architectural clean-up is likely to result in the smaller of the pair requiring less silicon real estate than the existing 32bit Cortex-A9.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , , , ,   |  Organizations: , ,
October 30, 2012

AMD mixes it up with ARM64 server processors

AMD adopts ARM64 to promote heterogeneous processing and encourage users to break with Intel and x86 in the enterprise market.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , , , ,   |  Organizations: ,
October 25, 2012

‘Known unknowns’ and the Cadence take on verification IP

Reviewing some of the sector's main trends with Susan Peterson, group director for VIP at the market leader.
Article  |  Topics: Blog Topics, Commentary, Blog - EDA, - Verification  |  Tags:   |  Organizations: , , , ,
October 25, 2012

Using verification IP to master AMBA and wider protocol proliferation

How and why Huawei's Hisilicon and DSP specialist CEVA tapped Cadence to implement ARM protocols.
Article  |  Topics: Blog Topics, Commentary, Blog - EDA, - Standards, Verification  |  Tags: ,   |  Organizations: , , ,
October 24, 2012

Tile-based integration of analog functions enables power controller family

Using a tile-based analog design methodology to produce power application controller ICs at Active-Semi
October 18, 2012

ST aims to seed more interest in FD-SOI

STMicroelectronics offers 28nm process to smaller scale users through CMP and Soitec
Article  |  Topics: Blog Topics, Blog - EDA  |  Tags: , ,   |  Organizations: ,
October 15, 2012

FinFETs face planar fightback at IEDM

Advanced SOI devices with hybrid channel materials may challenge the finFET's future dominance, says IBM
Article  |  Topics: Commentary, Conferences, Blog - EDA  |  Tags: , , , , , ,   |  Organizations: ,
October 11, 2012

Intel, TSMC finFETs to star at IEDM

Intel finFET family grows to support SoC use, as TSMC boosts p-channel performance with germanium
Article  |  Topics: Blog Topics, Commentary, Blog - EDA  |  Tags: , , , ,   |  Organizations: , ,
October 4, 2012

IEF: “Industry will have to cooperate”

The semiconductor industry is reaching a crunch point at which companies that form it have to work together much more closely, says Malcolm Penn of Future Horizons.
Article  |  Topics: Commentary, Conferences, Design to Silicon, Blog - EDA  |  Tags: , ,   |  Organizations: ,

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