Chipmaker

Open-source hardware is going to change the way people buy computing capacity for data centers, says LSI's Rob Ober

Achronix plans to use the FPGA fabric that it has developed for standalone products to be fabbed through Intel as the springboard for an embedded-FPGA offering.

Samsung Electronics is setting up a center in Silicon Valley to try to develop technologies that the company hopes will ultimately drive volume for its chipmaking operation.

TSMC follows Intel in taking a stake in ASML to accelerate development of EUV and 450mm lithography equipment.

The president and co-CEO of Synopsys provides his take on the mounting influence of software and physical effects in the creation of SoCs.

Xilinx says it has made the first public release of its Vivado Design Suite – the reworked design environment for its sub-40mn programmable-logic devices that is based more heavily on concepts from the custom-IC world than its existing ISE toolset.

Texas Instruments had good news for teams that want to assemble 3DIC stacks using thru-silicon vias (TSVs). The stress induced by the copper TSVs is not as bad as many feared for nanometer-scale transistors.

You want finFETs with different threshold voltages on the same SoC? Forget what the FD-SOI guys tell you: it's possible. At least with a certain amount of performance loss, say IBM and GlobalFoundries.

A deal between GlobalFoundries and STMicroelectronics has answered the question as to where ICs based on an FD-SOI process can be made, and not just for ST.

Intel's Ivy Bridge series of processors were designed from the outset to be split apart and recombined to create variants of the base platform, Intel architecture project manager Brad Heaney explained during the Wednesday keynote session at DAC 2012.