Chipmaker

Reviewing some of the sector's main trends with Susan Peterson, group director for VIP at the market leader.

How and why Huawei's Hisilicon and DSP specialist CEVA tapped Cadence to implement ARM protocols.

Using a tile-based analog design methodology to produce power application controller ICs at Active-Semi

STMicroelectronics offers 28nm process to smaller scale users through CMP and Soitec

Advanced SOI devices with hybrid channel materials may challenge the finFET's future dominance, says IBM

Intel finFET family grows to support SoC use, as TSMC boosts p-channel performance with germanium

The semiconductor industry is reaching a crunch point at which companies that form it have to work together much more closely, says Malcolm Penn of Future Horizons.

Open-source hardware is going to change the way people buy computing capacity for data centers, says LSI's Rob Ober

Achronix plans to use the FPGA fabric that it has developed for standalone products to be fabbed through Intel as the springboard for an embedded-FPGA offering.

Samsung Electronics is setting up a center in Silicon Valley to try to develop technologies that the company hopes will ultimately drive volume for its chipmaking operation.