Archives

June 13, 2014

Path to 5nm plotted at DAC panel

Panel discusses Moore's law scaling beyond the 14nm node to 5nm, where economic, device, interconnect, materials, lithography and design issues abound
Article  |  Topics: Conferences, Blog - EDA  |  Tags: , , , , , ,   |  Organizations: , , ,
June 10, 2014

Verilog-AMS release adds to power-aware analog modeling

Accellera has published version 2.4 of the Verilog-AMS standard for mixed-signal modeling and verification as the group works on a merger of the language with SystemVerilog.
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations:
June 5, 2014

Cliff Hou, TSMC VP R&D, on the route to 10nm – and beyond

Head of TSMC R&D talks about what it will take to develop and use 10nm, 7nm processes, and a possible shift to using packaging to extend Moore's law scaling
Article  |  Topics: Conferences, Design to Silicon  |  Tags: , , , ,   |  Organizations:
June 5, 2014

3D and EDA need to make up for Moore’s Law, says Qualcomm

Qualcomm is looking to monolithic 3D and smart circuit architectures to make up for the loss of traditional 2D process scaling as wafer costs for advanced nodes continue to increase.
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations:
June 3, 2014

Remember 20nm? Qualcomm does

Qualcomm will present at VLSI Technology Symposium 2014 a version of TSMC's 20nm technology that uses design and process tweaks to reduce the number of double-patterned layers.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: ,
June 2, 2014

Chipmaking’s future: all of the nodes all of the time

The stall in Moore's Law caused by the rapid rise in cost of the advanced processes will shift more innovation to mature nodes Monday keynoters at DAC said.
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations: ,
June 2, 2014

Samsung certifies Synopsys tools, IP at 14nm

Samsung, Synopsys and ARM have been working together to create a finFET design ecosystem.
Article  |  Topics: Conferences, Design to Silicon, Blog - IP  |  Tags: ,   |  Organizations: , ,
June 2, 2014

Synopsys uses virtual prototyping kits to kick start IP integration

Synopsys is porting its IP to a series of virtual prototyping kits in a plan to cut the amount of time that it takes to integrate new high-speed interfaces such as USB 3.0
Article  |  Topics: Blog - EDA, Embedded, IP  |  Tags: , , , ,   |  Organizations:
June 2, 2014

Emulation ‘heart of ESL’

The emulator has become the cornerstone of embedded system level (ESL) design on SoC projects, analyst Gary Smith claimed in a speech ahead of DAC 51.
Article  |  Topics: Blog - EDA  |  Tags: , , ,
May 29, 2014

Synopsys adds vector DSP operations to ARC EM processor IP

Synopsys has developed a digital signal processing (DSP) instruction set extension to its EM family and two cores that employ it.
Article  |  Topics: Blog - EDA  |  Tags: , ,   |  Organizations: