Deal quashes rumors that Altera was about to move its cutting edge production back to TSMC, but nor does it appear to be 'exclusive' for 3D products.
TSMC stays the course with new co-CEOs as Morris Chang retains executive leadership for now while finFET, 3D and other new technologies settle in.
Research group CEA-Leti expects to have design kits ready for a 10nm FD-SOI process in June 2014
In a keynote at the Intel Developer Forum, CEO Brian Krzanich said the company would start making 14nm processors by the year end and confirmed intel would license SoC designs to be fabbed by other companies.
Altera has disclosed a number of the features that will make it into the top end of its upcoming 'Generation 10' family of FPGAs.
The arrival of the finFET brings with it simulation and physical restrictions that might lead teams to resort to layout automation to get the job done.
The increasing use of graphics in mobile SoCs means that finFET processes need to be optimised for density and power - as well as early availability at low risk.
EDA companies are having to plan for the different ways in which double patterning and finFETs could move into fabs, Antun Domic of Synopsys explains.
An early shift to finFET processes is making developing IP libraries more challenging.
STMicroelectronics pushes on with FDSOI despite dissolution of ST-Ericcson joint venture that provided the lead customer for the process.
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