IEEE

Online paper submissions are now open for the 2017 Symposia on VLSI Technology and Circuits.

At the 62nd annual IEDM taking place in early December two of the leading groups in process development will take the wraps off their 7nm finFET technologies.

The International Electron Device Meeting has pushed back the deadline for its papers to get the latest developments in process and device design into the December conference.

A novel approach to 3D NAND will be among the presentations at the International Electron Device Meeting to be held in Washington, DC in December.

The Liberty library format has been extended to cope with the most common forms of on-chip variation analysis in use today on nanometer processes.

Accellera has released the latest version of the Universal Verification Methodology (UVM) class reference document, with additions to the way in which testbenches can handle messages and registers.

The group that developed the IEEE 1801 Unified Power Format standard is looking to bringing power modeling and estimation to the system level for version 3.0, due in 2015.

The latest revision of the IEEE 1801 Unified Power Format standard for verifying low-power designs has been made available through the IEEE Get Program.

In 2013, the Design Automation and Test in Europe (DATE) conference returns to Grenoble, France and with focus days on the Internet of Things and the cloud.

Cadence Design Systems has developed semiconductor IP for the automotive industry's OPEN Alliance to make ethernet the core networking backbone of future motor vehicles.