memory

August 5, 2019

Flash Memory Summit: Memblaze demos Toshiba ULL NVM technology

The Chinese memory module specialist will preview the 2020 launch of its new solution based on the ultra low latency XL-Flash technology from Toshiba.
Article  |  Topics: Conferences, Blog - Embedded, - Product  |  Tags: , , ,   |  Organizations: ,
July 2, 2019

SmartDV adds verification IP for OpenCAPI data-center standard

The verification IP is the first to become commercially available for the bus interface backed by companies such as AMD, Google, IBM, Micron and Xilinx.
January 2, 2018

The best in PCB design during 2017

Read some edited highlights from the most successful companies in Mentor's 2017 Technology Leadership Awards.
November 21, 2017

Siemens builds Mentor AMS offering with Solido buy

Solido acquisition will also add further machine learning expertise to Mentor's capabilities.
September 19, 2014

Cisco to absorb smart-memory IP

Cisco has decided to buy memory-controller specialist Memoir Systems and absorb the technology into its Insieme business unit, which specializes in data-center switch technologies, a move that underlines the issues facing small IP suppliers and their customers.
November 4, 2013

Rambus CEO calls for collaboration and an architectural focus for memory

Dr Ron Black also discussed his experiences with the Internet of Things in a lively keynote at the GSA Memory+ Conference in Taipei
Article  |  Topics: Commentary, Conferences, Blog - Embedded, IP  |  Tags: , , ,   |  Organizations:
October 23, 2013

3D-IC focus for GSA’s Taipei Memory+ event next week

Packed one-day event has speakers from Cadence, TSMC, Samsung, Amkor, Advantest and more providing a senior level view of making 3D-IC a reality. Registration closes soon.
October 22, 2013

Memory gets smarter for network speedups

Memoir Systems has developed a set of memory controller IP cores that exploit common access patterns used by processors in network switches to improve performance and power consumption
Article  |  Topics: Blog - EDA  |  Tags: , , , ,
October 3, 2012

SAME: Memory-saving standard to expand

The scope of the Low-Latency Interface (LLI) developed by the MIPI Alliance is expanding as it heads towards version 2 – increasing the ways in which a single DRAM array can be shared between SoCs in a mobile phone.
Article  |  Topics: Commentary, Blog - EDA, - ESL/SystemC  |  Tags: , , , ,   |  Organizations: ,
June 16, 2011

RS-DIMM rugged memory becomes XR-DIMM

We’ve just heard from the Small Form Factor Special Interest Group (SFF-SIG) that the RS-DIMM rugged embedded memory featured in the latest print edition of Tech Design Forum and online has been renamed XR-DIMM (eXtreme Rugged Dual In-Line Memory Module) with immediate effect. Paul Rosenfeld, SFF-SIG’s president, says the change is intended to “reflect the […]

Article  |  Topics: General, Tested Component to System  |  Tags: , ,

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