design


April 4, 2017

Registration opens for I Love DAC program

For the ninth year, I Love DAC badges will provide free access to the Design Automation Conference exhibition and pavilion sessions.
Article  |  Topics: Blog - EDA, IP, PCB  |  Tags: , , ,
February 20, 2012

Intel takes considered route to FinFET

The International Solid-State Circuits Conference (ISSCC) this year provided an opportunity to see how the team that was first to put a finFET or trigate-based process into action on a multi-million transistor design did it.
June 16, 2011

RS-DIMM rugged memory becomes XR-DIMM

We’ve just heard from the Small Form Factor Special Interest Group (SFF-SIG) that the RS-DIMM rugged embedded memory featured in the latest print edition of Tech Design Forum and online has been renamed XR-DIMM (eXtreme Rugged Dual In-Line Memory Module) with immediate effect. Paul Rosenfeld, SFF-SIG’s president, says the change is intended to “reflect the […]

Article  |  Topics: General, Tested Component to System  |  Tags: , ,
May 10, 2011

Japanese innovation is as important as Japanese manufacturing

Much has been written about the impact of the Japanese earthquake on supplies for existing products—and that’s fair enough. It is the industry’s most immediate worry, although it seems to have receded somewhat in the last few weeks. But I still can’t help but also be concerned about what the disaster means for design. Rolling […]

Article  |  Topics: Blog - EDA, - General  |  Tags: ,

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