Blog Topics

November 15, 2023

Siemens buys Insight for reliability addition to Calibre

Siemens has completed the acquisition of Insight EDA, a specialist in circuit-reliability analysis.
November 14, 2023

Imec makes virtual fab public for green analysis

Imec has a version of its imec.netzero virtual fab tool accessible to the general public with the aim of showing the environmental impact of IC manufacturing.
Article  |  Tags: , , , ,   |  Organizations:
November 6, 2023

Cadence combines ML techniques for power signoff

Cadence has linked several machine-learning approaches to build a tool that is designed to speed up the detection and diagnosis of on-chip power-integrity issues.
Article  |  Tags: , , ,   |  Organizations:
November 3, 2023

Codasip pips Arm to commercial CHERI with RISC-V version

Codasip has put support for a set of instruction extensions intended to secure memory into its RISC-V core designs.
November 2, 2023

X-Fab adds galvanic isolation to CMOS process

X-Fab has made it possible to put galvanic isolation based on capacitive coupling directly into chips made on its XA035 process.
Article  |  Tags: , , , , ,   |  Organizations:
November 1, 2023

Companies partner for embeddable ReRAM

SureCore and Intrinsic have teamed up to provide a way to implement resistive random-access memory as an SoC-embeddable technology.
Article  |  Tags: , ,   |  Organizations:
October 31, 2023

Accellera publishes draft of CDC standard

Accellera has published for public review version 0.1 of a standard designed to help pass clock-domain crossing information between EDA tools.
Article  |  Tags: , , ,   |  Organizations:
October 31, 2023

Imperas builds model of Tenstorrent AI core

Imperas Software has worked with AI specialist Tenstorrent to create and distribute a model of the Ascalon processor core.
October 25, 2023

Image sensors shrink at IEDM

This year’s IEDM features a number of papers that seek to drive down the size and boost the performance of image sensors.
October 25, 2023

VLSI Symposium 2024 looks to bridge digital and physical

The IEEE Symposium on VLSI Technology & Circuits switches back to Honolulu for its 44th year in the summer of next year and has issued its call for papers, with a deadline of early February for contributions.
Article  |  Tags: , , , ,

PLATINUM SPONSORS

Synopsys Cadence Design Systems Siemens EDA
View All Sponsors