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GlobalFoundries has signed deals to let the foundry offer power-saving clocks, a massively parallel floating-point processor and interface IP from Rambus. They are "uncommon solutions" to come from a foundry, the company claims.

Mentor's HyperLynx gets speed and accuracy enhancements, as well as more embedded help, to speed up fast board design

Cadence Design Systems has built into its latest Virtuoso update features designed to tackle the problems of working with the 20nm generation of processes with finer control over layout-dependent effects, double patterning and new types of local interconnect.

Even though inventories are slack right, chipmakers could be struggling to find wafers in 2014.

Future Horizon’s forecast meeting for the first half of 2013 made it clear how the electronics sector and the semiconductor industry in particular is facing big problems.

14nm finFET test-chip designs are moving through Samsung's fab as ARM, Cadence Design Systems and Synopsys continue to check their flows on the new process.

3D-IC integration techniques such as the use of TSVs, die stacking and interposers are unlikely to limit performance, according to research from TSMC and IBM

How to save money in process development by moving experiments out of the fab and into the computer.

Altera has cut a deal with ARM to bring unified debug support to the FPGA fabric and Cortex-A9 processors inside the Cyclone SoC products, using a specialized version of ARM’s DS5 tool.

Intel has launched its first server SoC, based on a stripped-down Atom, in a bid to seal its place in microservers before ARM can ready its 64bit architecture for production. But the chip seems more a stake in the ground than the answer for low-power servers.