Texas Instruments


May 7, 2015

EEMBC starts work on IoT-node power benchmark

Benchmarking organization EEMBC has kicked off an effort to develop a set of performance tests for edge nodes for the Internet of Things (IoT).
March 24, 2015

TI uses Cortex-M4F to provide low-power 32bit upgrade for MSP430

Texas Instruments has launched a family of ARM-based microcontrollers intended to act as a migration path from its low-energy 16bit MSP430 series, developing its own flash-capable 90nm process to implement them.
Article  |  Topics: Blog - Embedded  |  Tags: , , , , ,   |  Organizations: , , ,
March 26, 2014

Better Software, Faster!: free virtual prototyping book available now

Free book explains virtual prototyping and includes case studies about virtual prototyping from Altera, Bosch, GM, Hitachi, Lauterbach, Linaro, Microsoft, Renesas, Ricoh, Siemens, and TI.
Article  |  Topics: Verification  |  Tags: , ,   |  Organizations: , , , , , , , ,
May 7, 2013

DAC 2013 Preview V: Rounding out the keynotes

Cadence-and-Synopsys co-founder and Freescale's new CEO join the DAC 2013 program, while Qualcomm and TI line up to discuss their work in mobile comms as well as taking your questions.
April 24, 2013

The BeagleBone Black is uncorked

Half the price, a 1GHz processor, 2GB of integrated storage and some 'interesting' plug-in capes. All for $45. Let the wild Linux-Making begin.
Article  |  Topics: Blog Topics, Commentary, Blog - Embedded, PCB  |  Tags: , ,   |  Organizations:
April 10, 2013

H.265 begins to flavor the video codec soup

Two vendors have announced early adopter software implementations of the new video compression standard that promises an up to 50% bandwidth cut against H.264.
Article  |  Topics: Blog - Embedded, IP, - Standards  |  Tags: , , ,   |  Organizations: , ,
March 27, 2013

Are you in the BeagleBone queue yet?

With an April release date promised, we should soon have confirmation on the new processor and price tag for the stripped down embedded Linux development board.
Article  |  Topics: Blog Topics, Blog - Embedded  |  Tags: ,   |  Organizations:
June 14, 2012

Strained silicon beats TSV stress in 3DICs

Texas Instruments had good news for teams that want to assemble 3DIC stacks using thru-silicon vias (TSVs). The stress induced by the copper TSVs is not as bad as many feared for nanometer-scale transistors.
May 23, 2012

TI tool hands out low-power tips

Texas Instruments has put together a tool aimed at users of its MSP430 microcontroller family that will help cut the power consumption of their applications.
Article  |  Topics: Commentary, Blog - Embedded  |  Tags: , , , , ,   |  Organizations:

PLATINUM SPONSORS

Synopsys Cadence Design Systems Mentor - A Siemens Business
View All Sponsors