Qualcomm

June 4, 2015

COMPUTEX 2015: Qualcomm edges Intel out of UK smartwatch start-up

Blocks' promo video says its work was 'Funded by Intel' but Qualcomm has announced that the modular watch company will be using its Snapdragon 400.
Article  |  Topics: Conferences, Blog - Embedded, PCB  |  Tags: , ,   |  Organizations: , ,
June 1, 2015

Server, IoT acceleration on Intel’s mind in Altera buy

Altera has agreed to Intel's offer to buy the company, with FPGAs to be integrated into Xeon processors after 2016. Atoms will join programmable logic in IoT-oriented devices.
Article  |  Topics: Blog - Embedded, PCB  |  Tags: , , , , , , ,   |  Organizations: , , ,
April 21, 2015

Neuroprocessing to drive next wave of processor cores, says Qualcomm

Deep learning offers the next major opportunity for specialist processors, Qualcomm's Karim Arabi claimed in his keynote at Mentor Graphics’ U2U in San Jose.
Article  |  Topics: Blog - EDA, Embedded, IP  |  Tags: , , , , , ,   |  Organizations:
April 9, 2015

Mentor’s 2015 Valley User2User is less than two weeks away

IoT-themed keynotes from Mentor's Wally Rhines and Qualcomm's Karim Arabi headline vendor's User2User conference on April 21.
January 7, 2015

CEA-Leti deals with heat issue on monolithic 3DIC

At IEDM 2014, CEA-Leti presented a technique that prevents damage to base-layer transistors in monolithic 3DIC processes. As work progresses, the institute is preparing to receive 3DIC designs in 2017.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , ,   |  Organizations: ,
November 12, 2014

Chip tariff eliminated and the big winner is… China?

Not just Intel and TI but also Lenovo and Huawei have cause to welcome end to 25% import tax. And could it even help reinvigorate Chinese start ups?
July 4, 2014

Qualcomm takes 28nm to China in SMIC deal

Chinese foundry Semiconductor Manufacturing International Corporation (SMIC) is to get a helping hand to develop a production-class 28nm process from Qualcomm Technologies.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations: , ,
June 13, 2014

Path to 5nm plotted at DAC panel

Panel discusses Moore's law scaling beyond the 14nm node to 5nm, where economic, device, interconnect, materials, lithography and design issues abound
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June 5, 2014

3D and EDA need to make up for Moore’s Law, says Qualcomm

Qualcomm is looking to monolithic 3D and smart circuit architectures to make up for the loss of traditional 2D process scaling as wafer costs for advanced nodes continue to increase.
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June 3, 2014

Remember 20nm? Qualcomm does

Qualcomm will present at VLSI Technology Symposium 2014 a version of TSMC's 20nm technology that uses design and process tweaks to reduce the number of double-patterned layers.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: ,

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