Chipmaker

February 26, 2015

Embedded world wakes up to security

Unsettled by attacks on embedded devices such as the point-of-sale terminals used by retailers such as Target and the potential for hackers to target critical infrastructure, the industry focused squarely on security at this year’s Embedded World in Nürnberg, Germany.
February 24, 2015

All aboard the IoT starter kit bandwagon

A variety of organizations used Embedded World to introduce kits to attract a broader base of developers looking at Internet of Things (IoT) applications.
Article  |  Topics: Blog - Embedded  |  Tags: , ,   |  Organizations: ,
February 16, 2015

CDNLive Silicon Valley: last chance for early bird discount

The $99 discount registration price for Cadence's main US user conference will no longer be available after Friday (February 20)
Article  |  Topics: Conferences, Blog - EDA, Embedded, IP, PCB  |  Tags: ,   |  Organizations: ,
February 3, 2015

ARM to upgrade smartphone processing with Cortex-A72 combination

ARM has launched a 64bit processor core aimed at high-end mobile phones, coupled to a new graphics processor and cache-coherent interconnect.
Article  |  Topics: Blog - Embedded, IP  |  Tags: , , ,   |  Organizations:
January 27, 2015

ARM to provide safety docs for real-time processors

ARM has picked up TÜV Süd certification for a version of its C compiler and produced an ISO 26262 documentation pack for the Cortex-R5 processor
Article  |  Topics: Blog - Embedded, IP  |  Tags: , , , , ,   |  Organizations:
January 19, 2015

Ambiq uses subthreshold techniques to cut power on ARM MCUs

Research by the University of Michigan into subthreshold circuit design has led to spinoff company Ambiq Micro creating a family of microcontrollers that it claims provide an ARM Cortex-M4F with power consumption at levels normally associated with an M0+.
January 7, 2015

CEA-Leti deals with heat issue on monolithic 3DIC

At IEDM 2014, CEA-Leti presented a technique that prevents damage to base-layer transistors in monolithic 3DIC processes. As work progresses, the institute is preparing to receive 3DIC designs in 2017.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , ,   |  Organizations: ,
December 16, 2014

14nm/16nm finFETs debut at IEDM

The International Electron Device Meeting (IEDM) has once again provided a chance for the major chipmakers to go head-to-head with their latest processes - this time with finFETs.
Article  |  Topics: Blog - EDA  |  Tags: , ,   |  Organizations: , ,
November 24, 2014

A57 finFET design underlines routing challenges

In a presentation at the recent ARM TechCon, HiSilicon described the issues in putting together a 16nm finFET-based design built around a cluster of ARM’s Cortex A57 processors.
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations: ,
November 12, 2014

Chip tariff eliminated and the big winner is… China?

Not just Intel and TI but also Lenovo and Huawei have cause to welcome end to 25% import tax. And could it even help reinvigorate Chinese start ups?