Sigasi creates SDK for custom editors
Sigasi has launched a software kit to provide inhouse tools builders and EDA vendors with a way to build in code-editing features.
Tech Design Forum Briefing
Briefing Authors
Paul Dempsey
Paul Dempsey has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.
Luke Collins
Luke Collins is a freelance technology journalist with 22 years’ experience. He is a former Editor-in-Chief of Electronics Times in the UK, and co-founded the IP9x series of conferences.
Chris Edwards
Chris Edwards has spent two decades covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology.
IEDM switches to virtual format for 2020
The organizers of the 66th annual IEDM have decided to hold the December conference virtually.
Mentor to use UltraSoC acquisition to drive in-life learning
Siemens has agreed to acquire UK-based debug and on-chip instrumentation startup UltraSoC and will fold the operation into Mentor’s Tessent test-software product line.
How to draw upon Mentor-Microsoft integration for embedded IoT
The combination of Embedded Linux and Azure is supported by services and technologies that speed the delivery and deployment of MCU-based projects.
Kioxia looks to waferscale flash drives for fast, low-cost storage
Waferscale SSDs are among the future drive architectures being explored by Kioxia, according to a keynote delivered at VLSI Symposia.
How Ambarella met the demands of automotive DFT
Even experienced IC design houses must adopt innovative and emerging strategies to meet functional safety and other demands of ISO 26262 for automotive systems.
Siemens raises Capital to full E/E design level
Capital has been grown from a wire harness suite to a full electrical/electronic platform with integration for digital twin strategies.
Transistor stacks piled high at VLSI
As 2D scaling becomes increasingly difficult, researchers reporting at VLSI Symposia have focused attention on what can be done in the third dimensions to improve density and performance without a sudden break from conventional CMOS processes.
EDA in the cloud boosts DRC iterations for AMD
AMD worked with Microsoft and Azure to cut DRC runtimes and control memory usage for a 7nm cloud-based design.
Onchip sensors aim for finer-granularity heat measurements
Moortec has reworked its thermal-sensing core design to allow for finer-grained use on SoCs being designed for the 5nm node.