Author Archives: Chris Edwards

About Chris Edwards

Chris Edwards has spent a long time covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology. His work has appeared in a variety of international newspapers including The Guardian, The Daily Telegraph, The Age and the South China Morning Post.
February 12, 2019

IEDM looks to spin glasses and brain-like platforms

IEDM plans to expand its range of coverage for the 2019 event to encompass a range of novel computing platforms, from neuromorphic architectures to machines that emulate thermodynamic systems.
Article  |  Topics: Blog - EDA  |  Tags: , ,   |  Organizations:
February 1, 2019

Fast process access gets Moortec onto 7nm

Early access to tools for new processes is helping Moortec deliver IP to determine the real-time health of on-chip circuits.
January 22, 2019

HPC futures report puts acceleration first

A report put together by Europe's HiPEAC high-performance computing research network argues computing is at an architectural turning point
January 7, 2019

Ceva extends control-oriented DSP

Ceva has followed its IoT-oriented Ceva-X series of processor cores with a more powerful family that is designed to handle control and signal-processing algorithms using the same pipeline.
Article  |  Topics: Blog - Embedded, IP  |  Tags: , , ,   |  Organizations:
December 12, 2018

IEDM shows progress on embedded eMRAM

Embedded magnetic RAM is emerging as a contender for on-chip memory not just from a density standpoint but from that of power.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , ,   |  Organizations: , , ,
December 6, 2018

Microchip opts for RISC-V cores in SoC FPGA

Microsemi has put multiple RISC-V cores into a new generation of SoC FPGAs, intended for embedded systems that need to run Linux.
Article  |  Topics: Blog - Embedded, IP  |  Tags: , , ,   |  Organizations: ,
December 5, 2018

Leti takes the heat off monolithic 3D

CEA-Leti claimed at IEDM to have achieved major steps in bringing monolithic 3D integration closer to production readiness.
Article  |  Topics: Blog - EDA  |  Tags: , ,   |  Organizations:
December 4, 2018

Achronix builds machine learning IP into eFPGA

Achronix has incorporated direct support for machine learning into the latest version of its eFPGA architecture.
Article  |  Topics: Blog - IP  |  Tags: , , , ,   |  Organizations:
November 13, 2018

Accellera updates UVM reference implementation

Accellera has updated the reference implementation for the Universal Verification Methodology to reflect the changes made for the latest release of the standard.
Article  |  Topics: Blog - EDA  |  Tags: ,   |  Organizations:
November 6, 2018

Netronome launches chiplet initiative for network-accelerator SIPs

Data-center networking specialist Netronome has recruited a number of silicon makers and IP suppliers to a standard for chiplet designs that can be used in SIPs for edge computers and servers.
Article  |  Topics: Blog - EDA, IP, PCB  |  Tags: , , ,   |  Organizations: , , , ,