Blog Topics

November 17, 2023

Siemens takes automotive digital twin to the AWS cloud

Siemens has made its PAVE360 automotive digital-twin software available on AWS, with the ability to access fast Arm models on the same cloud.
November 16, 2023

Cadence and Autodesk bring together cloud CAD tools

Cadence and Autodesk have linked their respective cloud-based PCB and mechanical design tools.
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November 15, 2023

Siemens buys Insight for reliability addition to Calibre

Siemens has completed the acquisition of Insight EDA, a specialist in circuit-reliability analysis.
November 14, 2023

Imec makes virtual fab public for green analysis

Imec has a version of its imec.netzero virtual fab tool accessible to the general public with the aim of showing the environmental impact of IC manufacturing.
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November 6, 2023

Cadence combines ML techniques for power signoff

Cadence has linked several machine-learning approaches to build a tool that is designed to speed up the detection and diagnosis of on-chip power-integrity issues.
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November 3, 2023

Codasip pips Arm to commercial CHERI with RISC-V version

Codasip has put support for a set of instruction extensions intended to secure memory into its RISC-V core designs.
November 2, 2023

X-Fab adds galvanic isolation to CMOS process

X-Fab has made it possible to put galvanic isolation based on capacitive coupling directly into chips made on its XA035 process.
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November 1, 2023

Companies partner for embeddable ReRAM

SureCore and Intrinsic have teamed up to provide a way to implement resistive random-access memory as an SoC-embeddable technology.
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October 31, 2023

Accellera publishes draft of CDC standard

Accellera has published for public review version 0.1 of a standard designed to help pass clock-domain crossing information between EDA tools.
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October 31, 2023

Imperas builds model of Tenstorrent AI core

Imperas Software has worked with AI specialist Tenstorrent to create and distribute a model of the Ascalon processor core.