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Applied Materials and CEA-Leti have expanded their collaboration with the creation of a joint lab to develop materials useful for sensors, RF communications, and power devices, and with a focus on heterogeneous integration.

Start-up launches platform on path to the specification, emulation and simulation of large chiplet-based designs.

EMA Design Automation to launch sister company, Accelerated Designs, to help clients streamline processes, cut manual effort, and connect data.

Solido discusses how it has leveraged AI for SPICE level efficiency and the benchmarks it has used.

Arm has added machine-learning extensions and pointer-security instructions to its latest Cortex-M series core.

South Korea's leading research institute has built a reusable flow for lower power petaflops-performance AI.

Siemens has made its PAVE360 automotive digital-twin software available on AWS, with the ability to access fast Arm models on the same cloud.

Siemens has completed the acquisition of Insight EDA, a specialist in circuit-reliability analysis.

Imec has a version of its imec.netzero virtual fab tool accessible to the general public with the aim of showing the environmental impact of IC manufacturing.

Cadence has linked several machine-learning approaches to build a tool that is designed to speed up the detection and diagnosis of on-chip power-integrity issues.