COMPUTEX 2015: Wrap 1 – Is ‘The Internet of Things’ that helpful an idea?
Everybody knows the words. Everybody has a different definition. Did calling the next big thing 'The Internet of Things' actually create a hindrance not a help?
Blog Topics
COMPUTEX 2015: Taiwan and mainland China face off in IoT platforms
It wasn't just ARM and TSMC that launched a 55nm IoT platform this week. Across the Taiwan Strait, Brite and SMIC have unveiled a similar offering. The competition could tell us a lot about the IoT market's future.
COMPUTEX 2015: Acer founder urges Taiwan to shift focus to software
Stan Shih says the Internet of Things is forcing Taiwan to reconsider its traditional concentration on electronics hardware.
Cadence deploys parallel strategy for faster synthesis
RTL synthesis has joined the array of tools developed by Cadence Design Systems that employ distributed processing, with the aim of exploring more ways of creating area- and power-efficient logic blocks.
ARM eases interconnect, debug, third-party IP integration for SoCs
Technology from Duolog acquisition used to ease the configuration of interconnect, debug and trace - and the integration of third-party IP
Cortus adds Arduino interface to SoC development board
Arduino Due shield interface makes adding peripherals to a Cortus-based SoC prototype easier.
Facing a future of dark silicon
Dennard’s Scaling ended years ago and Moore’s Law is slowing down. What will the future hold for the semiconductor industry?
COMPUTEX 2015: Intel sets out battle plan for Thunderbolt I/O
Thunderbolt speed to double to 40GBit/s, cheaper ownership for consumers, proprietary plug dumped in favor of USB-C as Intel looks to reinvigorate tech.
Server, IoT acceleration on Intel’s mind in Altera buy
Altera has agreed to Intel's offer to buy the company, with FPGAs to be integrated into Xeon processors after 2016. Atoms will join programmable logic in IoT-oriented devices.
Avago and Broadcom: integration of another kind?
Last week's announcement by Avago that it would buy Broadcom looks to be only partly about bulk. The merger could help drive SIP and 3DIC integration.