IP

April 7, 2021

Accellera publishes security standard draft

Accellera has published the version 1.0 draft of the proposed Security Annotation for Electronic Design Integration standard.
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March 31, 2021

Arm looks to explore new realms for security with v9

Arm aims to introduce a novel security model in its upcoming v9 architecture along with further extensions for AI.
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December 17, 2020

Arm expands cloud migration on Arm-based machines at AWS

Arm is pushing more work onto Arm servers in the AWS cloud as it encourages EDA vendors to port their tools to the architecture.
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December 17, 2020

Macronix proposes 3D to breathe life back into NOR flash

At IEDM this year, Macronix showed how a 3D architecture may bring back NOR flash, which stopped scaling a decade ago.
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November 27, 2020

RISC-V in nearly a quarter of designs (Wilson Functional Verification 2020 – Part One)

Use of the open-source RISC-V processor was tracked for the first time by the biennial study, finding notably high take-up.
November 2, 2020

Arm starts pulling security extensions into processor cores

The Arm Cortex-A78C extends the reach of the core into larger tablets and brings in one of a series of memory-protections extensions that will be used in the company's standard cores.
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October 15, 2020

DVCon Europe: using all the tools at your disposal

Among the papers that will be presented at the end of October, this year's DVCon Europe will demonstrate the benefits of taking good ideas from wherever you can in the pursuit of more effective verification flows.
October 7, 2020

Arm seeks to define baseline software compatibility for IoT and edge devices

SystemReady program takes server firmware and operating system compatibility concepts into the embedded and IoT space.
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September 14, 2020

nVidia commits to buy Arm from Softbank

Graphics and AI specialist nVidia has been confirmed as the buyer of Arm from Softbank Vision Fund in a transaction worth up to $40bn, with the fund retaining a 10 per cent share in Arm if the deal completes.
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August 25, 2020

TSMC fills in sub-nodes as EUV gains ground

TSMC is using its growing experience with EUV lithography to fill in sub-nodes between its major releases as it prepares to extend finFET technology to the forthcoming N3 process.
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