JEDEC

June 17, 2021

Standard arrives for thermal simulation data

A de facto standard for exchanging thermal information about designs has become JEDEC standard JEP181.

Article | Topics: Blog - EDA, PCB | Tags: chip-package integration, Flotherm, supply chain, system-level design, thermal analysis, thermal modeling, thermal simulation | Organizations: JEDEC, Siemens EDA

February 27, 2018

Synopsys UFS 3.0 IP doubles bandwidth to flash

Faster, lower power flash interface IP with built-in encryption/decryption speeds access to embedded and removable storage.

Article | Topics: Blog - IP, - Product | Tags: MIPI, UFS, UFS 3.0 | Organizations: JEDEC, MIPI Alliance, Synopsys

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