Author Archives: Paul Dempsey

About Paul Dempsey

Paul Dempsey is editor-in-chief of Tech Design Forum and has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.
May 14, 2013

DAC 2013 REMINDER: ‘No Free Monday’

But you can still get in for free by registering for the 'I Love DAC' scheme by this Friday (May 17th).
Article  |  Topics: Conferences, Blog - EDA  |  Tags:
May 14, 2013

DAC 2013 Preview VI: CEO ‘visions’ added

Leaders from Cadence, Jasper, Mentor and Synopsys are late additions to DAC 2013, giving 15-minute pre-keynote talks previewing design's next half century.
May 7, 2013

DAC 2013 Preview V: Rounding out the keynotes

Cadence-and-Synopsys co-founder and Freescale's new CEO join the DAC 2013 program, while Qualcomm and TI line up to discuss their work in mobile comms as well as taking your questions.
April 29, 2013

DAC 2013 Preview IV: Management and Training Days

DAC 2013 will offer a series of dedicated training courses in SystemVerilog, SystemC, and ARM-based design as well as its regular management day bridging the gap between technology and business.
Article  |  Topics: Conferences, Blog - EDA  |  Tags: , ,   |  Organizations: , , ,
April 25, 2013

Hear Alexander Graham Bell speak for the first time

And then bear in mind that the father of telephony is telling all design engineers a cautionary tale: Documentation. Documentation. Documentation.
Article  |  Topics: Blog Topics, Commentary, Blog - EDA, Embedded, IP, PCB  |  Tags: ,
April 24, 2013

The BeagleBone Black is uncorked

Half the price, a 1GHz processor, 2GB of integrated storage and some 'interesting' plug-in capes. All for $45. Let the wild Linux-Making begin.
Article  |  Topics: Blog Topics, Commentary, Blog - Embedded, PCB  |  Tags: , ,   |  Organizations:
April 24, 2013

DAC 2013 Preview III: Embedded

DAC 2013 wants to bridge the gap between hardware and embedded software technical conferences, and has dedicated 35% of this year's technical program to that goal.
Article  |  Topics: Conferences, Blog - EDA, Embedded  |  Tags: , , , , , ,
April 10, 2013

FinFET father headlines Mentor’s west coast user conference

Dr Chenming Hu joins Mentor CEO Wally Rhines and Xilinx SVP Victor Peng to keynote free day-long User2User in San Jose on April 25th, capping a full technical program.
Article  |  Topics: Conferences, Blog - EDA, Embedded, PCB  |  Tags:   |  Organizations: , ,
April 10, 2013

3D-IC cooling ascends the agenda

US defense research agency DARPA sets targets for cooling overall systems and hot spots in stacked silicon, and backs joint research from Rockwell-Collins and Georgia Tech.
Article  |  Topics: Design to Silicon, Blog - EDA  |  Tags: ,   |  Organizations: , ,
April 10, 2013

H.265 begins to flavor the video codec soup

Two vendors have announced early adopter software implementations of the new video compression standard that promises an up to 50% bandwidth cut against H.264.
Article  |  Topics: Blog - Embedded, IP, - Standards  |  Tags: , , ,   |  Organizations: , ,