Author Archives: Chris Edwards

About Chris Edwards

Chris Edwards has spent a long time covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology. His work has appeared in a variety of international newspapers including The Guardian, The Daily Telegraph, The Age and the South China Morning Post.
October 26, 2021

Arm SystemReady adjusts to compatibility issues

Arm’s SystemReady program has revealed a number of the subtleties involved when trying to maintain software compatibility with operating systems without moving to the straightjacket of platforms like those used for the x86-based PC.
Article  |  Topics: Blog - IP, PCB  |  Tags: , , , ,   |  Organizations:
October 26, 2021

Arm accelerates library verification with Solido ML

Arm has used machine-learning tools supplied by the Solido group at Siemens Digital Industries Software to speed up IP validation runtime a thousand-fold compared to conventional statistical methods.
Article  |  Topics: Blog - EDA, IP  |  Tags: , ,   |  Organizations: ,
October 18, 2021

Three ways to 3D feature at IEDM

Three highlighted papers at IEDM, taking place in December, show the different approaches to the use of the vertical dimension to cut energy use and improve density.
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations: , , ,
October 18, 2021

DAC prepares for winter show

The program for the 58th Design Automation Conference, which returns to a physical format in December, is online and is running its I Love DAC promotion for free access until the end of this month.
October 13, 2021

DVCon events stick with virtual format and add speakers

DVCon US use a virtual platform for its event to be held in the spring and the organisers of the European event will employ a more sophisticated version of the virtual 3D space debuted last year.
Article  |  Topics: Blog - EDA  |  Tags: , , ,   |  Organizations:
October 7, 2021

Combined database underpins 3DIC design suite

Cadence has built a unified database to support a group of tools to support the planning and implementation of 3DIC designs.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , , , , ,   |  Organizations:
September 24, 2021

Siemens brings chip-design flow to DARPA Toolbox Initiative

Siemens EDA has become the first of the major EDA vendors to join the DARPA Toolbox Initiative.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , ,   |  Organizations: , , , ,
September 13, 2021

Cadence organizes on-device AI into three families

Cadence has organized its machine-learning platforms into three families intended to cover a wide range of on-device AI applications.
Article  |  Topics: Blog - IP  |  Tags: , , ,   |  Organizations:
August 31, 2021

Connected cars call for safety islands

A Siemens Tessent white papers examines the role of safety islands in advanced automotive systems.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , ,   |  Organizations:
August 23, 2021

IEDM 2021 publishes course schedule

Aiming for a primarily physical event in the fall, organisers of the 2021 IEDM have published the tutorial and short-core schedule.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: