Blog Topics

April 22, 2015

Mentor tool streamlines multi-corner parasitic extraction

Mentor Graphics has launched Calibre xACT, a tool that uses deterministic algorithms to extract parasitics from complex finFET and other nanometer processes.
April 21, 2015

Neuroprocessing to drive next wave of processor cores, says Qualcomm

Deep learning offers the next major opportunity for specialist processors, Qualcomm's Karim Arabi claimed in his keynote at Mentor Graphics’ U2U in San Jose.
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April 21, 2015

Are you ready for design for crime?

Designers will need to take crime into account as part of their design signoff process, Wally Rhines argued in his keynote at Mentor Graphics' U2U San Jose 2015 conference.
April 21, 2015

Cadence updates OrCAD line with additions for PCB manufacturability and integrity

Cadence Design Systems has added five products to its OrCAD line of PCB-design tools that cover manufacturability, signal integrity and management, and introduced three feature updates.
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April 20, 2015

Leakage analysis checks IP cores against crypto vulnerability

The Athena Group says it has developed countermeasures against side-channel attacks for its IP that offer the best protection currently available.
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April 9, 2015

Mentor’s 2015 Valley User2User is less than two weeks away

IoT-themed keynotes from Mentor's Wally Rhines and Qualcomm's Karim Arabi headline vendor's User2User conference on April 21.
March 26, 2015

Xmos brings programmable networking to Gigabit Ethernet

Xmos has launched a series of microcontrollers based on its timesliced multicore architecture that adds Gigabit Ethernet interfaces.
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March 24, 2015

DAC 52 keynotes focus on body-worn electronics and vehicle design

The 2015 Design Automation Conference in San Francisco will feature keynotes that focus on body-worn electronics such as Google’s Smart Contact Lens and automotive issues.
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March 24, 2015

TI uses Cortex-M4F to provide low-power 32bit upgrade for MSP430

Texas Instruments has launched a family of ARM-based microcontrollers intended to act as a migration path from its low-energy 16bit MSP430 series, developing its own flash-capable 90nm process to implement them.
March 24, 2015

Mentor unites chip-to-package flow with Xpedition Package Integrator

Flow draws on existing strengths in Xpedition, Valor, Nimbic and Flotherm among others to optimize 3D design projects and improve cross-disciplinary communication.

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