Design to Silicon

March 15, 2012

CPTF notebook: From restricted to ‘proscriptive’ design rules

Ever increasing lithography challenges mean the next generation of design rules may concentrate on telling you just what you can rather than what you cannot do.
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March 15, 2012

CDN Live: Cadence’s Encounter revamp collates innovation

Performance boost claimed from streamlining optimization across synthesis and layout using modeling, novel CTS strategy and 20nm-ready features.
March 14, 2012

DATE notebook: EDA for the rest of us

Old processes don't necessarily equate to old tools, panelists argued at DATE, especially when a lot of future work will be done on more-than-Moore, 3DIC technologies.
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March 14, 2012

By the numbers: investment, equipment, sales

We round up the latest headline forecasts and performance data from the Global Semiconductor Alliance (GSA), manufacturers association SEMI and the Semiconductor Industry Association.
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March 13, 2012

ARM decodes a surprising power benefit

ARM has found that in its work on processor design looking at the system-design and process issues as well as the way software interacts with the machine can yield surprising results.
March 8, 2012

ISQED focuses on systems, education and sensors

The International Symposium on Quality Electronic Design (ISQED) enters its 13th edition later this month, running March 19-21 at Techmart in Santa Clara. Although ISQED traditionally concentrated on tools and IP blocks, its agenda has broadened as the industry has migrated to SoCs and full electronic systems where process and manufacturing interactions have come to […]

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February 29, 2012

Technical Newsletter #1: Common Platform, Samsung, ARM, Cadence

Our first email newsletter previews next month's Common Platform Technology Forum 2012 and features exclusive interviews with senior staff at Samsung, ARM and Cadence Design Systems.
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February 29, 2012

Full-flow 450mm line in 2015 says IMEC

Belgian research institute IMEC has stepped up its plans for 450mm development and now aims to have an operational full-flow pilot line by the end of 2015, according to president Luc Van den hove speaking at ISS Europe this week.
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February 28, 2012

‘Virtual foundry’ plan for plastic chips

The COLAE project will use the production facilities at European research centres to provide printed-electronics production services to startups. But it will probably involve more joint process work than the conventional foundry model.
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February 20, 2012

Intel takes considered route to FinFET

The International Solid-State Circuits Conference (ISSCC) this year provided an opportunity to see how the team that was first to put a finFET or trigate-based process into action on a multi-million transistor design did it.
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