HyperLynx update automates SerDes validation
Simulation suite automates the largely manual process of validating more than 25 SerDes protocols.
PCB
Capacity shortages loom if 2017 growth repeats
If current market trends persist, shortages in wafers are likely to follow, hurting the ability of some companies to ship silicon and boost the prices for those who can.
The best in PCB design during 2017
Read some edited highlights from the most successful companies in Mentor's 2017 Technology Leadership Awards.
PCB tool rewrite to expand platform choices
Altium has rewritten its PCB-design software to improve graphics performance and provide the opportunity to port to non-Windows operating systems such as OS X.
VLSI Symposia 2018 looks to machine learning
Machine learning is among the focus topics at next year's Symposia on VLSI Technology & Circuits in Honolulu, which has issued its call for papers.
Siemens sees Mentor helping to build fast digital twins
An emulator that extends the reach of hardware acceleration into the world of multiphysics analysis could result from the merger of Siemens PLM Software with Mentor.
TSMC encapsulates CoWoS for supersized SiP
TSMC encapsulated the multiple chips assembled on a 1200mm2 silicon substrate to cut the chance of damage from warping with the company's CoWoS2 SiP technology.
Tektronix scope reconfigures for mixed signals
An ASIC-based design has allowed Tektronix to build an oscilloscope that can mix and match analog and digital channels.
Mentor builds links for multichip package integration
Mentor, a Siemens business, has formed an alliance with foundries and OSAT providers and launched a flow that brings IC and package design together.
Cadence pulls Virtuoso and Allegro closer for 3DIC
Cadence Design Systems has brought its chip- and PCB-design environments closer together as the shift towards multichip packages gains pace.