Thin copper iodide films point to better transparent PMOS
Researchers working at Dongguk University have found thinning layers of copper iodide can make transparent, high-mobility p-channel transistors
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IEDM looks to spin glasses and brain-like platforms
IEDM plans to expand its range of coverage for the 2019 event to encompass a range of novel computing platforms, from neuromorphic architectures to machines that emulate thermodynamic systems.
DVCon USA 2019 preview: Mentor
DVCon USA is coming soon. Mentor's 2019 involvement includes a keynote from parent Siemens and a tutorial on managing your formal verification processes.
Taking an IoT edge design from proof-of-concept to prototype
A new paper describes a case study for a pressure-sensing IoT application based on the ARM DesignStart platform and Mentor IoT tool flow.
Safety and test IP heads for automotive AI applications
Automotive AI specialist FABU has licensed a portfolio of IP from Synopsys to help assemble ISO 26262-compliant SoCs
Fast process access gets Moortec onto 7nm
Early access to tools for new processes is helping Moortec deliver IP to determine the real-time health of on-chip circuits.
Creating a $4B market for silicon photonics
It's been a long time coming, but silicon photonics is now entering commercial design for networking and grabbing attention in autonomous driving and sensors.
HPC futures report puts acceleration first
A report put together by Europe's HiPEAC high-performance computing research network argues computing is at an architectural turning point
Video series details the physical verification process
Physical verification challenge of large SoCs on leading-edge processes detailed in video series
Ceva extends control-oriented DSP
Ceva has followed its IoT-oriented Ceva-X series of processor cores with a more powerful family that is designed to handle control and signal-processing algorithms using the same pipeline.