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A leading researcher argues that graphene will not replace but complement silicon and thrive in specialist applications.

FinFETs for 7nm and below processes will be able to integrate high-mobility III-V materials despite being built on silicon processes, thanks to recent work by imec.

The complexity of on-chip interconnect and the relentless growth in software size will drive the move to a four-stage verification process as well as the increased use of formal techniques to speed up SoC-level testing, Mentor Graphics verification specialist Mark Olen claimed at the Verification Futures conference.

Training company Doulos is working on a second version of its Easier UVM guidelines intended to speed up the process of getting a UVM testbench underway for new users.

Microchip Technology has become the latest company to use easy access to middleware to encourage embedded-systems developers to move over to its platform.

Cadence Design Systems uses parallelism in its Voltus tool to provide faster IR drop analysis and bridge static timing and IC-level power-integrity analysis.

Highway1 has opened up Spring applications for its incubation service for hardware startups: trying to overcome the gap between prototype and product.

Synopsys has launched the ARC HS family of configurable-processor cores, using superpipelining to target high-performance embedded applications.

Jasper Design Automation has developed a tool that analyzes RTL and gate-level HDL for hidden paths that may expose on-chip secure elements to hackers.

Dr Ron Black also discussed his experiences with the Internet of Things in a lively keynote at the GSA Memory+ Conference in Taipei