EDA

June 21, 2018

Samsung couples EUV with DTCO for 7nm shrink

Samsung Electronics expects to increase savings on die area in the shift from its 10nm to 7nm node by applying both EUV for critical layers and several layout-focused process changes.
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June 21, 2018

DAC 2018 preview: Real Intent

Real Intent's move into post-synthesis CDC debug leads its DAC 2018 activities, with technical papers on its new Verix PhyCDC tool also now online for those who cannot make it.
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June 21, 2018

DAC 2018 preview: Breker Verification Systems

The portable stimulus pioneer will demonstrate how the technology and standard have been leveraged for its new Trek5 release.
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June 21, 2018

RRAM to sniff out hydrogen from fuel cells

Panasonic and AIST have turned a resistive memory (RRAM) into a hydrogen sensor that they claim works at much lower energy than existing designs.
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June 20, 2018

Micron sees NAND powering on as DRAM struggles

Despite the intense R&D going into storage-class and other novel forms of non-volatile memories, flash is set to continue as the bulk memory of choice, Micron executive claims in VLSI Symposia keynote.
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June 20, 2018

SAR-VCO combo tunes RF receiver power on 16nm

Researchers from the UC Berkeley and Intel teamed up to develop an energy-tuneable RF front-end on a digital finFET process with no need for analog process options.
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June 20, 2018

DAC 2018 preview: Mentor

Mentor will be present throughout the DAC program but with a particular focus on machine learning, artificial intelligence and automotive challenges.
June 20, 2018

DAC 2018 preview: Austemper Design Systems

Functional safety specialist will demonstrate extensions to its own suite and co-host demos highlighting its collaboration with OneSpin Solutions.
June 19, 2018

DAC 2018 preview: ESD Alliance

The Electronic System Design Alliance will discuss its recent decision to join SEMI and highlight DAC's new Infrastructure Alley.
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June 19, 2018

DAC 2018 preview: Baum

Power analysis specialist will showcase the 2.0 edition of its PowerBaum analysis and modeling suite at DAC.
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