Author Archives: Chris Edwards

About Chris Edwards

Chris Edwards has spent a long time covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology. His work has appeared in a variety of international newspapers including The Guardian, The Daily Telegraph, The Age and the South China Morning Post.
June 21, 2017

Panels see congestion and resistance dominate the leading-edge node battle

Placement-aware synthesis and an array of post-layout recovery steps have helped drive up the clock speed and silicon utilization of a series high-end SoCs on leading-edge processes developed by customers of Synopsys' implementation tools.
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations: , , , ,
June 20, 2017

Siemens sees Mentor helping to build fast digital twins

An emulator that extends the reach of hardware acceleration into the world of multiphysics analysis could result from the merger of Siemens PLM Software with Mentor.
Article  |  Topics: Blog - EDA, Electrical Design, Embedded, PCB  |  Tags: , , , , , , , ,   |  Organizations: ,
June 20, 2017

ARM puts Cortex-M3 into DesignStart program

ARM has expanded its DesignStart program by providing access to the Cortex-M3 as well as the M0 with no up-front licence fee.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , ,   |  Organizations:
June 19, 2017

Joe Costello claims IoT will drive wave of design

Former Cadence CEO tells DAC the IoT will lead to a burgeoning of chip design starts, followed by a brutal consolidation.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , , ,   |  Organizations:
June 19, 2017

UltraSoc donates trace format to RISC-V group

UltraSoc has donated to the RISC-V Foundation a specification for processor trace to try to provide the ecosystem with a common way of exporting runtime data to software tools.
Article  |  Topics: Blog - Embedded, IP  |  Tags: , , , ,   |  Organizations: ,
June 18, 2017

TSMC encapsulates CoWoS for supersized SiP

TSMC encapsulated the multiple chips assembled on a 1200mm2 silicon substrate to cut the chance of damage from warping with the company's CoWoS2 SiP technology.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , , ,   |  Organizations:
June 18, 2017

Samsung 7nm uses EUV and split fin widths to push speeds

EUV and fin optimization help build Samsung's upcoming 7nm process, the company discloses at the VLSI Technology Symposium.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations:
June 15, 2017

Early access view of portable-stimulus standard released

Accellera has released an Early Adopter version of the upcoming Portable Stimulus Specification.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , ,   |  Organizations:
June 15, 2017

Microsemi builds Windows IDE for RISC-V

Semiconductor supplier Microsemi has used the Eclipse open-source IDE platform to develop a Windows-based toolchain for CPUs that supports the RISC-V instruction set.
Article  |  Topics: Blog - Embedded, IP  |  Tags: , , ,   |  Organizations:
June 15, 2017

Smart code editor adds SystemVerilog support

Sigasi has added support for SystemVerilog to its Sigasi Studio tool, which uses a built-in parser to perform more reliable syntax highlighting and error checking
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: