PCB

Cadence Design Systems has expanded its use of machine learning for EDA into PCB design, joining a growing number of suppliers who have decided it is a sector that needs the AI treatment.

The key to exploiting AI is being clear about where its family of technologies can help to improve and democratize design.

The Austin-based start-up used Siemens EDA software to deploy a cutting-edge Smart Substrate based on advanced packaging technology.

Teledyne e2v has demonstrated a prototype optical link that the company believes could replace electrical signaling for remote RF heads.

A new white paper offers useful tips and techniques for PDN analysis and performance optimization in designs such as those using DDR4.

At December's Design Automation Conference, AMD senior vice president Sam Naffziger provided more insights into the chipmaker’s use of chiplet-based design and manufacture.

FHE use-cases are evolving and the NextFlex consortium is looking to smooth their path with a strategy, PDKs and reference modules.

University of Florida researcher proposes third-party checks on chiplets to demonstrate they are free of trojans.

Arm’s SystemReady program has revealed a number of the subtleties involved when trying to maintain software compatibility with operating systems without moving to the straightjacket of platforms like those used for the x86-based PC.

What companies do internally to digitalize matters, but so does using the concept to optimize their supply chain with partners.