February 1, 2024
Cadence has introduced a platform for performing thermal and thermal-stress analysis of subsystems, from 2.5D and 3DICs to PCBs and complete electronic assemblies.
November 16, 2023
Cadence and Autodesk have linked their respective cloud-based PCB and mechanical design tools.
September 20, 2023
Ultra Librarian has developed an AI-driven CAD modeling engine that should slash the the time it takes to build component and subsystem models for PCB layout and system design.
September 14, 2023
Cadence has given its new release of OrCAD access to the cloud-based AI placer designed for its Allegro PCB-layout software.
June 14, 2023
Siemens is integrating the Supplyframe platform with the Xpedition PCB-design software to give engineers better visibility into component availability.
June 12, 2023
AT&S and Imec partnered to develop a way of putting low-loss waveguides into conventional PCBs to support D-band automotive radar and 6G modules.
June 1, 2023
Siemens has published a white paper that examines whether package designers need to adopt IC tools and design styles in the move from organic packages to 2.5DIC packages.
April 6, 2023
Cadence Design Systems has expanded its use of machine learning for EDA into PCB design, joining a growing number of suppliers who have decided it is a sector that needs the AI treatment.
December 1, 2022
The key to exploiting AI is being clear about where its family of technologies can help to improve and democratize design.
November 23, 2022
The Austin-based start-up used Siemens EDA software to deploy a cutting-edge Smart Substrate based on advanced packaging technology.