Blog Topics

October 22, 2020

Mentor and Arm collaborate on RTL verification reviews

Functional verification for increasingly complex ARM-based designs is at the heart of the new consultancy partnership.
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October 15, 2020

DVCon Europe: using all the tools at your disposal

Among the papers that will be presented at the end of October, this year's DVCon Europe will demonstrate the benefits of taking good ideas from wherever you can in the pursuit of more effective verification flows.
October 12, 2020

Arm’s Project Cassini edges closer to cloud-like embedded platforms

At its DevSummit, Arm talked about the progress being made in Project Cassini, an initiative to bring cloud-style deployment and management tools to connected embedded systems.
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October 8, 2020

DVCon Europe brings virtual rooms to online conference

As part of its move online during the pandemic, DVCon Europe is introducing what the organizers call Virtual Experience Rooms.
October 7, 2020

Arm seeks to define baseline software compatibility for IoT and edge devices

SystemReady program takes server firmware and operating system compatibility concepts into the embedded and IoT space.
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September 14, 2020

Aprisa team to be doubled after Mentor purchase

Mentor, a Siemens business, plans to expand the team working on the Aprisa place-and-route tool following the purchase of Avatar Integrated Systems, announced in July.
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September 14, 2020

nVidia commits to buy Arm from Softbank

Graphics and AI specialist nVidia has been confirmed as the buyer of Arm from Softbank Vision Fund in a transaction worth up to $40bn, with the fund retaining a 10 per cent share in Arm if the deal completes.
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August 27, 2020

Cloud access to emulator helps AI processor start-up prove design, win funding

Small startup gets flexible cloud access to big iron to prove a novel processor architecture quickly.
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August 27, 2020

Automotive E/E design demands a multi-domain, system-led approach

Increasing complexity means that teams must leverage automation to work across disciplines, speed delivery and free room for innovation.
August 25, 2020

TSMC fills in sub-nodes as EUV gains ground

TSMC is using its growing experience with EUV lithography to fill in sub-nodes between its major releases as it prepares to extend finFET technology to the forthcoming N3 process.
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