EEMBC starts work on IoT-node power benchmark
Benchmarking organization EEMBC has kicked off an effort to develop a set of performance tests for edge nodes for the Internet of Things (IoT).
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Cadence upgrades debug for system-level era
Cadence Design Systems has launched a debug tool designed to improve the speed of bug hunting in SystemVerilog but which the company expects to grow into analog and post-silicon work.
UltraSoC pushes debug over USB
UltraSoC has added the ability to employ a USB 2.0 port instead of JTAG as the main debug access point on SoCs that use the company’s UltraDebug technology.
ARM extends ISO 26262 safety work up to A-class
ARM is extending its work on ISO 26262 safety packages for automotive systems beyond the Cortex-R devices supported in a documentation release earlier this year.
Neuroprocessing to drive next wave of processor cores, says Qualcomm
Deep learning offers the next major opportunity for specialist processors, Qualcomm's Karim Arabi claimed in his keynote at Mentor Graphics’ U2U in San Jose.
Xmos brings programmable networking to Gigabit Ethernet
Xmos has launched a series of microcontrollers based on its timesliced multicore architecture that adds Gigabit Ethernet interfaces.
DAC 52 keynotes focus on body-worn electronics and vehicle design
The 2015 Design Automation Conference in San Francisco will feature keynotes that focus on body-worn electronics such as Google’s Smart Contact Lens and automotive issues.
TI uses Cortex-M4F to provide low-power 32bit upgrade for MSP430
Texas Instruments has launched a family of ARM-based microcontrollers intended to act as a migration path from its low-energy 16bit MSP430 series, developing its own flash-capable 90nm process to implement them.
Mentor unites chip-to-package flow with Xpedition Package Integrator
Flow draws on existing strengths in Xpedition, Valor, Nimbic and Flotherm among others to optimize 3D design projects and improve cross-disciplinary communication.
IoT and RF ‘to drive FD-SOI adoption’
The FD-SOI technology developed by CEA-Leti and STMicroelectronics is beginning to gain ground as chipmakers investigate the process as a way to deliver low-energy, wireless-capable SoCs.