Digital/analog implementation

Whether you're going to DAC this week or not, it's worth remembering one of the other key factors that will inform your judgments on new tools.

Latest addition to DesignWare portfolio balances trade-offs across CPUs, GPUs and DSPs while automating custom design techniques such as multi-bit flip flops.

Cadence-and-Synopsys co-founder and Freescale's new CEO join the DAC 2013 program, while Qualcomm and TI line up to discuss their work in mobile comms as well as taking your questions.

FinFETs, ever proliferating verification, 3DIC, security and more feature on our guide to some of the most intriguing panels at DAC 2013.

Using a tile-based analog design methodology to produce power application controller ICs at Active-Semi

Cadence Design Systems has updated both of its printed circuit board (PCB) tools – Allegro and Orcad – to improve their handling of design constraints, multiuser design and deal with embedded components and mechanical CAD tools.

A deal between GlobalFoundries and STMicroelectronics has answered the question as to where ICs based on an FD-SOI process can be made, and not just for ST.

Designers working on mixed-signal circuits will benefit from using digital tools, Cadence's SVP of R&D for custom design said at CDNLive EMEA today. But for those who don't a faster fast Spice is on its way.

Robert Bosch is expecting to see major growth in electronics in cars over the coming decade. But most of that growth will not be coming from electric vehicles of the four-wheeled variety, said the company's automotive division president.

Old processes don't necessarily equate to old tools, panelists argued at DATE, especially when a lot of future work will be done on more-than-Moore, 3DIC technologies.