April 10, 2013
US defense research agency DARPA sets targets for cooling overall systems and hot spots in stacked silicon, and backs joint research from Rockwell-Collins and Georgia Tech.
April 9, 2013
At DATE 2013, Synopsys senior vice president Antun Domic, described how techniques for the latest nodes are being rolled back into mature nodes, all the way to 180nm.
April 8, 2013
FinFETs, ever proliferating verification, 3DIC, security and more feature on our guide to some of the most intriguing panels at DAC 2013.
April 4, 2013
Accellera Systems Initiative has created a working group to look at one of the knottiest problems in IC design: to simplify the job of checking designs when the bits come from so many sources and use languages that were not built for interoperability.
April 1, 2013
In the first of our weekly DAC 2013 previews, we discuss program highlights with general chair Yervant Zorian, including an expanded Designer Track, keynotes and golden jubilee celebrations.
March 20, 2013
EDA companies are having to plan for the different ways in which double patterning and finFETs could move into fabs, Antun Domic of Synopsys explains.
March 20, 2013
Docea Power extends power and thermal analysis tools to address complexity and sub-dividing responsibilities among architects.
March 20, 2013
Don't underestimate the influence of metallic nanotubes and tube alignment, say Stanford researchers.
March 20, 2013
An early shift to finFET processes is making developing IP libraries more challenging.
March 20, 2013
Accellera Systems Initiative has published the language reference manual for the latest version of its mixed-signal simulation environment based on SystemC. Version 2.0 of SystemC-AMS adds support for more dynamic behaviors in the analog domain.